Treść książki
Przejdź do opcji czytnikaPrzejdź do nawigacjiPrzejdź do informacjiPrzejdź do stopki
Spistreści
Odautora
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Wykazskrótów
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1.Obróbkawarstwywierzchniej
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1.1.
Klasyfkacjaobróbkipowierzchniowejlllllllllllllllllllllllllllllllllllllllllllllllll
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1.2.
Koncepcjainżynieriipowierzchnilllllllllllllllllllllllllllllllllllllllllllllllllllll
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1.3.
Kryteriadoboruprocesówwytwarzaniawarstwywierzchniejlllllllllllllllllllllllllllllll
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1.4.
Naprężeniawłasnelllllllllllllllllllllllllllllllllllllllllllllllllllllllllllllll
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1.5.
Przyczynyzniekształceniawyrobówllllllllllllllllllllllllllllllllllllllllllllllllll
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1.6.
Zmianakształtuiwymiarówwyrobówhartowanychllllllllllllllllllllllllllllllllllllll
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1.7.
Podstawoweobróbkiwarstwywierzchniejwyrobówstalowychllllllllllllllllllllllllllllll
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1.8.
Ograniczeniaprojektowelllllllllllllllllllllllllllllllllllllllllllllllllllllllllll
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1.9.
Przygotowaniepowierzchnipodłożallllllllllllllllllllllllllllllllllllllllllllllllll
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1.10.Plazmawinżynieriipowierzchnilllllllllllllllllllllllllllllllllllllllllllllllllllll
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1.10.1.Plazmallllllllllllllllllllllllllllllllllllllllllllllllllllllllllllllllll
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1.10.2.Właściwościplazmyllllllllllllllllllllllllllllllllllllllllllllllllllllllll
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1.10.3.Plazmaniskotemperaturowawobróbcewarstwywierzchniejlllllllllllllllllllllllll
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1.11.Magnetronoweźródłorozpylanialllllllllllllllllllllllllllllllllllllllllllllllllllll
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1.12.Przewodnictwoelektrycznelllllllllllllllllllllllllllllllllllllllllllllllllllllllll
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2.Materiałyiichwłaściwości
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2.1.
Rodzajemateriałówlllllllllllllllllllllllllllllllllllllllllllllllllllllllllllllll
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2.1.1.Metaleiichstopyllllllllllllllllllllllllllllllllllllllllllllllllllllllllll
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2.1.2.Ceramikaiszkłolllllllllllllllllllllllllllllllllllllllllllllllllllllllllll
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2.1.3.Polimerylllllllllllllllllllllllllllllllllllllllllllllllllllllllllllllllll
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2.1.4.Kompozytylllllllllllllllllllllllllllllllllllllllllllllllllllllllllllllll
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SPiSTREśCi
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