Treść książki
Przejdź do opcji czytnikaPrzejdź do nawigacjiPrzejdź do informacjiPrzejdź do stopki
5.4.
Metodyzapobieganiakorozjielektrochemicznejlllllllllllllllllllllllllllllllllllllllll
161
5.4.1.Projektowanielllllllllllllllllllllllllllllllllllllllllllllllllllllllllllll
162
5.4.2.Dobórmateriałuiobróbkillllllllllllllllllllllllllllllllllllllllllllllllllll
163
5.4.3.Powłokiochronnellllllllllllllllllllllllllllllllllllllllllllllllllllllllll
165
5.4.4.inhibitorylllllllllllllllllllllllllllllllllllllllllllllllllllllllllllllllll
170
5.4.5.Ochronakatodowalllllllllllllllllllllllllllllllllllllllllllllllllllllllll
171
5.4.6.Pasywacjalubochronaanodowallllllllllllllllllllllllllllllllllllllllllllll
172
6.Obróbkawarstwywierzchniejbezzmianyjejskładuchemicznego
lllllllllllllllll173
6.1.
Utwardzanieodkształceniowe(mechaniczne)lllllllllllllllllllllllllllllllllllllllllll
173
6.1.1.Dogniatanierolkamilllllllllllllllllllllllllllllllllllllllllllllllllllllllll
174
6.1.2.Kulowaniellllllllllllllllllllllllllllllllllllllllllllllllllllllllllllllll
175
6.1.3.Utwardzanielaserowelllllllllllllllllllllllllllllllllllllllllllllllllllllll
175
6.2.
Hartowaniepowierzchniowellllllllllllllllllllllllllllllllllllllllllllllllllllllll
177
6.2.1.Staledohartowaniapowierzchniowegolllllllllllllllllllllllllllllllllllllllll
179
6.2.2.Mikrostrukturalllllllllllllllllllllllllllllllllllllllllllllllllllllllllllll
180
6.2.3.Grubośćwarstwyzahartowanejlllllllllllllllllllllllllllllllllllllllllllllll
182
6.2.4.Zmianawymiarówllllllllllllllllllllllllllllllllllllllllllllllllllllllllll
182
6.2.5.Zaletyhartowaniapowierzchniowegolllllllllllllllllllllllllllllllllllllllllll
182
6.2.6.Hartowanieindukcyjnellllllllllllllllllllllllllllllllllllllllllllllllllllll
183
6.2.7.Hartowaniepłomieniowelllllllllllllllllllllllllllllllllllllllllllllllllllll
184
6.3.
Obróbkapowierzchniowalaseremllllllllllllllllllllllllllllllllllllllllllllllllllll
186
6.4.
Hartowaniewiązkąelektronówllllllllllllllllllllllllllllllllllllllllllllllllllllll
188
6.5.
Przetopieniewarstwywierzchniejllllllllllllllllllllllllllllllllllllllllllllllllllll
188
7.Obróbkacieplno-chemiczna
lllllllllllllllllllllllllllllllllllllllllllllllllllllllll190
7.1.
Podstawyobróbkicieplno-chemicznejlllllllllllllllllllllllllllllllllllllllllllllllll
191
7.1.1.Potencjałwęglowyllllllllllllllllllllllllllllllllllllllllllllllllllllllllll
192
7.1.2.Dyfuzja-podstawylllllllllllllllllllllllllllllllllllllllllllllllllllllllll
193
7.1.3.Gęstośćmocyplazmywdyfuzyjnejobróbceplazmowejlllllllllllllllllllllllllllll
196
7.2.
Nawęglanielllllllllllllllllllllllllllllllllllllllllllllllllllllllllllllllllllll
198
7.2.1.Temperaturallllllllllllllllllllllllllllllllllllllllllllllllllllllllllllll
202
7.2.2.Czasllllllllllllllllllllllllllllllllllllllllllllllllllllllllllllllllllll
204
7.2.3.Staledonawęglaniallllllllllllllllllllllllllllllllllllllllllllllllllllllll
205
7.2.4.Nawęglaniewośrodkustałym(wproszkach)lllllllllllllllllllllllllllllllllllll
207
7.2.5.Nawęglaniewcieczyllllllllllllllllllllllllllllllllllllllllllllllllllllllll
209
7.2.6.Nawęglaniegazowellllllllllllllllllllllllllllllllllllllllllllllllllllllll
210
7.2.7.Nawęglaniepróżniowellllllllllllllllllllllllllllllllllllllllllllllllllllll
214
7.3.
Plazmoweprocesydyfuzyjneobróbkiwarstwywierzchniejlllllllllllllllllllllllllllllllll
216
7.4.
Nawęglaniewzłożufluidalnymllllllllllllllllllllllllllllllllllllllllllllllllllllll
221
7.5.
Obróbkacieplnaponawęglaniulllllllllllllllllllllllllllllllllllllllllllllllllllll
222
7.5.1.Mikrostrukturastalinawęglonejllllllllllllllllllllllllllllllllllllllllllllllll
223
7.5.2.Węglikilllllllllllllllllllllllllllllllllllllllllllllllllllllllllllllllllll
225
7.6.
Azotonawęglanielllllllllllllllllllllllllllllllllllllllllllllllllllllllllllllllll
226
7.6.1.Azotonawęglaniewcieczylllllllllllllllllllllllllllllllllllllllllllllllllll
229
7.6.2.Azotonawęglaniegazowellllllllllllllllllllllllllllllllllllllllllllllllllll
230
8
SPiSTREśCi
